Dry bed absorption in the semiconductor industry is a safe, passive method for exhaust gas treatment in ion implantation, SiO2 etching, … and as an emergency absorber gas cabinet. It removes toxic substances through chemical reactions on solid adsorbents; key terms here are chemisorption, stoichiometric reaction, and degree of purification. Commonly occurring gases to be removed (toxic & greenhouse gases) include ammonia, hydrogen chloride, silanes, NF3, CF4, SF6, AsH3, B2H6, TEAO, BCl3, …. and their “metabolic products” in the reaction chambers. Adsorbents used include, for example, activated carbon, zeolites, iron oxides, silicon dioxide, zinc oxide, etc. Dry bed absorption offers high efficiency and space savings. And it requires less maintenance and reduces environmental impact compared to burner/scrubber combinations. Challenges include the regeneration of the adsorbents, the monitoring of operating conditions, and the disposal of the material.