Dry bed absorption in the semiconductor industry is a safe, passive method of treating exhaust gases from ion implantations, SiO2 etching, ... and as an emergency absorber gas cabinet. It removes toxic substances through chemical reactions on solid adsorbents, key words here are chemisorption, stoichiometric reaction, degree of purification. Common gases to be removed (toxic & greenhouse gases) are ammonia, hydrogen chloride, silanes, NF3, CF4, SF6, AsH3, B2H6, TEAO, BCl3, .... and their "metabolic products" in the reaction chambers. Adsorbents used include activated carbon, zeolites, iron oxides, silka, zinc oxide, .... Dry bed absorption offers high efficiency and space savings. And it requires less maintenance and reduces the environmental impact compared to burner/scrubber combinations. Challenges include regenerating the adsorbents, monitoring the operating conditions and disposing of the material.